Nearly all PVD cathodes are water cooled. Depending on the requirements of the particular system and material you are using, your target material may need to be bonded to a copper, molybdenum, or other metallic heat sink. The bonding process insures the thermal integrity of the interface between your system’s cooling assembly and the surface of the target, which experiences the most heat. We strongly recommend that all ceramic sputtering targets be bonded.
Types of Bonds
Planar Indium Bond – The most common target bond utilizes pure Indium metal as the bonding agent. This metal melts at 156 C which may limit the amount of power applied to a target during deposition. SCI is capable of bonding planar targets up to 12 feet long.
Rotatable Indium Bond – Large area coating often utilizes a rotatable sputtering target. SCI has developed a rotatable indium bond that allows ceramic targets to be bonded to stainless steel or titanium backing tubes up to 4 meters in length.