Backing Plate Debonding & Rebond for Cost-Effective Sputtering
Stop discarding valuable precision hardware and start reusing your backing plates with our comprehensive Backing Plate Debonding service. Unfortunately, many thin film manufacturers treat backing plates as consumable items, scrapping them along with the spent target material. However, high-quality Oxygen-Free High Thermal Conductivity (OFHC) Copper and Molybdenum plates are durable assets designed for multiple lifecycles. To solve this, we offer a specialized debonding process that safely removes the spent target, cleans the interface, and qualifies the plate for immediate reuse—often at no additional cost when you order your new target from SCI.
Tomorrow's Tech Solutions
The Debonding & Cleaning Process
We use thermal and chemical processes to strip the plate without damaging its critical dimensions.
Safe Indium Removal
First, we utilize precise thermal control to melt the Indium bond (Melting point: 156.6 °C/313.9F) and separate the spent target material. (Learn more about our
Surface Reconditioning
Furthermore, once the target is removed, we chemically clean and mechanically recondition the bonding surface to remove oxides and residual interlayers. This step is critical to ensure the new bond achieves 100% wetting and thermal transfer.
Inspection & Qualification
Finally, every debonded plate is inspected for flatness, warpage, and cooling channel integrity. We ensure your plate meets the original OEM specifications before it is approved for rebonding.
Maximize Your Hardware Investment
Reusing backing plates significantly reduces the Total Cost of Ownership (TCO) for your sputtering process.
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Material Savings: Copper (Cu), Molybdenum (Mo), and Titanium (Ti) prices are volatile. By reusing your existing plates, you eliminate the raw material risk and machining costs associated with buying new hardware.
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Faster Turnaround: If you have a rotating stock of backing plates, we can debond and rebond your targets in a continuous loop, reducing lead times compared to fabricating new plates from scratch.
Explore Related Materials & Services
Ready for Bonding?
Once your plate is clean, it needs a new target. Explore our Planar Indium Bonding service to attach your new ceramic or metal tiles with precision.
Sourcing New Targets?
We can manufacture high-purity Metal & Alloy Sputtering Targets to mount directly onto your freshly reconditioned backing plates.
Scrap Recycling
What happens to the old target material we removed? If it contains precious metals, our PGM Recycling service can recover the value and credit it to your account.
Start Saving with SCI's Debond & Rebond Service
Contact us to learn more about how our Debond/Rebond Service can save you money. Request a quote today!