Ensure the survival and performance of your most delicate sputtering materials with our specialized Planar Indium Bonding service. Because ceramic and oxide targets are brittle and prone to cracking under thermal stress, a standard bond is often insufficient. Therefore, we utilize a pure Indium layer (99.99%) which acts as a compliant thermal interface, absorbing the stress caused by the Coefficient of Thermal Expansion (CTE) mismatch between the target and the copper backing plate. This service is our longest-standing capability, refined over decades to handle everything from standard R&D tiles to large-area multi-tile assemblies.