High-Purity Tantalum Sputtering Targets for Advanced PVD
Elevate your Physical Vapor Deposition (PVD) process with SCI Engineered Materials’ high-performance tantalum sputtering targets. As a refractory metal, Tantalum (Ta) is valued for its remarkable chemical inertness, exceptional corrosion resistance, and an ultra-high melting point of 3,017°C. These properties make it the definitive high-purity Tantalum deposition material for mission-critical applications across the semiconductor, medical, and aerospace industries. We provide custom-manufactured, ultra-dense targets in both high-density planar and rotary targets (up to 99.99% purity) to ensure stable, uniform film characteristics and maximum utilization in your PVD system.
Experience Unmatched Quality and Performance
Key Applications for Tantalum Thin Films
We specialize in precision tantalum sputtering targets designed to meet the demands of advanced thin-film engineering:
Semiconductor Diffusion Barriers
Tantalum is the industry-standard Ta semiconductor barrier layer and seed layer used in copper (Cu) interconnects. Its superior properties prevent the diffusion of copper atoms into silicon or surrounding dielectric materials, a process crucial for maintaining the integrity and low resistance of modern microchips.
(Referenced:
High-K Capacitors & Memory
Tantalum thin films are critical precursors for Tantalum Pentoxide (Ta₂O₅), a high-K dielectric material. This enables the fabrication of high-reliability, high-capacitance Ta capacitor thin films essential for DRAM (Dynamic Random-Access Memory) and other advanced energy storage devices.
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Biocompatible Coatings
Due to its chemical inertness, non-toxic nature, and ability to form a stable oxide layer (Ta₂O₅), Tantalum is deposited as a biocompatible Ta coating material on various medical implants, including orthopedic devices and surgical instruments, ensuring long-term performance and osseointegration.
(Referenced: Tantalum as a Novel Biomaterial for Bone Implant: A Literature Review)
Tantalum (Ta) Technical Information
| Purity | Melting Point | Hardness | Yield Strength/Tensile | Available Geometries | Backing Plate Options |
|
3,017 °C | 6.5 | 170-300MPa |
|
Planar:
Rotatable:
|
Manufacturing Excellence and Specialized Target Services
Our expertise ensures that every high-density tantalum target delivers maximum performance and consistency. Our production process maintains controlled microstructure and tight impurity limits, minimizing particle generation for highly uniform films in high-volume production.
Target Bonding: We offer state-of-the-art Indium Bonding services to ensure optimal thermal and electrical conductivity, which is vital for maximizing the lifespan and stability of your ultra-pure Ta planar rotary target.
Custom Configurations: From large-area rotary target assemblies to specialized planar configurations, we engineer tailored solutions to seamlessly integrate with any PVD system, including options for Copper, Molybdenum, or Stainless Steel backing plates.
Recycling & Repress: Our comprehensive services include the reprocessing of spent target backers and the Virgin Powder Repress process, offering significant cost savings while maintaining high material purity standards.
Get Started with High-Purity Tantalum
Contact us to learn more about how our high-quality Tantalum Sputtering Targets can support your specific microelectronics application needs. Request a quote today!