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Repressing Noble Metal Ruthenium Targets to Reduce the Cost of Bipolar Plate Manufacturing in Fuel Cells

Sputtering is a preferred coating technique for manufacturing bipolar plates due to the technique's uniformity, and resilience to impurity contamination. However, due to the high cost of noble-metal powder combined with the low utilization of planar sputtering targets (15%-30%), the target becomes one of the costliest factors within the process. At SCI, we have developed a procedure whereby small portions of virgin metal powder are added on top of spent targets to fill in the depleted/sputtered area. Our process produces a high-density target with an interface between the original target and additional powder that does not inhibit the sputtering process. We have found that, depending on target geometry, a spent target backer can be repressed up to ten times before the noble metal backer would need to be fully reclaimed. This repressing process can lead to cost savings on noble metal powder of up to 50%.